Drying times of components

Drying Times of Components

Reference Table

Our reference table offers you recommended drying times of your components. Please read it dependent on component strength, MSL Level, temperature and humidity Level.

MSL levelDrying at 1% RH
(HSD, MSD & XSD-Series)
Drying at 2% RH
(SDB, SD, SD+ & ESDA Serie)
**Drying at 5% RH
(N2-Cabinets)
 
25°C
1% RH
40°
1% RH
60°
1% RH
25°
2% RH
40°
2% RH
40°
5% RH
90°
5% RH
 
Body thickness ≤ 1,4 mm2
3 days36 hours10 hours
8 days3 days
8 days17 hours
2a
4 days2 days12 hours
9 days4 days
9 days23 hours
*3
8 days3 days18 hours
12 days5 days
13 days33 hours
4
9 days4 days24 hours
15 days6 days
15 days37 hours
5
10 days5 days30 hours
17 days7 days
17 days41 hours
5a
10 days6 days36 hours
22 days9 days
22 days54 hours
 
Body thickness ≤ 2,0 mm2
18 days8 days2 days
25 days10 days
25 days63 hours
2a
22 days10 days2 days
30 days15 days
29 days3 days
3
23 days11 days2 days
35 days16 days
37 days4 days
4
28 days14 days3 days
40 days17 days
47 days5 days
5
35 days16 days4 days
50 days24 days
57 days6 days
5a
56 days18 days4 days
67 days27 days
79 days8 days
 
Body thickness > 2,0 mm :: ≤ 4,5 mm2
67 days20 days5 days
80 days30 days
79 days10 days
2a
67 days22 days5 days
80 days30 days
79 days10 days
3
67 days22 days5 days
80 days31 days
79 days10 days
4
67 days22 days5 days
80 days31 days
79 days10 days
5
67 days22 days5 days
80 days31 days
79 days10 days
5a
67 days22 days5 days
80 days31 days
79 days10 days

* according to 100TQFP-Test (Semiconductor Device (100TQFP) Dehumidifying Property)
** according to IPC J-STD-033C