Long-term test for oxidation in a drying cabinet
Direct Comparison of Nitrogen and Dry Storage. Which is the more effective protection against oxidation?
Long term storage WITHOUT Nitrogen
Controlling Oxidation and Intermetallics in Moisture-sensitive Devices without the use of Nitrogen.
Customer article : Zollner
Zollner Elektronik relies on automated storage systems from Super Dry Totech.
Floor Life Reset of Components & MSDs
Increased process control and multiple batch management
Dry Tower case study with ProDrive
Creating the factory of the future – installation of Totech Dry Tower to deliver automated processes for component handling & storage.
Moisture management technical articles collection
In this collection of articles published in SMT 007 magazine, Rich Heimsch of Super Dry Totech discusses the issues of moisture damage and specialized moisture management and tracking technology for Components and PCBs.
Drying Printed Circuit Boards
Investigation into whether gentle drying at 45°C or 60°C & at low relative humidity achieves the same result as baking at high temperatures.
CALCE Best Practices Controlling Moisture in PCBs
Overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, & dependent variables.
Managing Moisture Damage in PCBs
Safe & effective PCB drying accomplished without damaging high temperatures using ultra low humidity drying enclosures to produce an atmosphere containing less than 0.05g/m3 water vapor.
Enhanced Adsorption Drying Procedures for MSDs
How with the use of adsorption dry storage cabinets, all MSDs can be not only stored safely, but also dried quickly, gently & in a process-secure way.
Combating Oxidation & Inter-metallics in Moisture Sensitive Components
Avoid the damage of micro cracks & delaminating during the processing of electronic components with appropriate storage.
Solutions for long-term storage of electronic components
Solutions for the storage of electronic components and compositions to avoid two of the biggest defect causes: Oxidation and Diffusion.
Moisture Measurements in PCBs and Impact of Design on Desorption Behaviour. Originally published in the IPC Printed Circuit Expo, APEX & Designer Summit Proceedings.
MSD Handling: Desiccants & Nitrogen, Myths & Opportunities
The safeguarding of the quality and reliability of electronic assemblies starts with the controlled storage of components and PCBs.
Newly Optimized Drying Process for Moisture Sensitive Devices.
New high performance desiccant drying units for the first time make it possible to dynamically adjust the necessary desiccant regeneration process according to actual demand.
Reference Conditions for Drying Mounted or Unmounted SMD
Table of recommended drying time for MSDs.
Floor life begins counting at time = 0 after drying